SEMICONDUCTOR DEVICE AND MANUFACTURE THEREOF

摘要

PURPOSE: To realize a semiconductor device which is almost free from thermal stress when it is mounted on a printed board. CONSTITUTION: A semiconductor device is equipped with an LSI chip 41, a protective frame 44, and a lead structure 42. The lead structure 42 is composed of a first lead structure 60 and a second lead structure 61. The first lead structure 60 is formed of a Cu foil lead 50. The second lead structure 61 is composed of a large number of fine and short pins 51 and a silicone resin base which holds the pins 51 in array. The second lead structure 61 bonds the pins 51 to the corresponding Cu foil leads 50. The pins 51 are so constituted as to be deflected to absorb thermal stress.