发明名称 MANUFACTURE OF BONDING WIRE
摘要 PURPOSE: To provide a manufacturing method of a wire wherein the exchange frequency of a capillary can be reduced by increasing the number of times of bonding until abnormality generation due reverse deformation when a loop is formed. CONSTITUTION: A surface layer eliminating treatment is performed on an intermediate yarn stock obtained by plastic-working an ingot. After a wire is formed by stretching the yarn stock, final annealing and post-treatment of wire lubricant coating are performed. Thereby adhesion of the wire lubricant is increased, troubles causing loop abnormality are hardly generated, and the capillary exchange frequency is reduced.
申请公布号 JPH08321525(A) 申请公布日期 1996.12.03
申请号 JP19950126257 申请日期 1995.05.25
申请人 TANAKA DENSHI KOGYO KK 发明人 TOBIYAMA TAEKO;IGA SUKEHITO;NAGAMATSU ICHIRO;ITABASHI KEIKO
分类号 C21D9/52;C23F1/00;H01L21/60 主分类号 C21D9/52
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