发明名称 MANUFACTURE OF BONDING WIRE
摘要 PURPOSE: To provide a manufacturing method of a bonding wire wherein the capillary exchange frequency of a bonding equipment can be remarkably reduced, by increasing the number of times of bonding until abnormal loop generation due to reverse deformation when a loop is formed. CONSTITUTION: In wire lubricant coating process, a wire 1 is introduced in a lubricant solution tank 15 and dipped in wire lubricant 16. When the wire 1 is led out from the solution, the angle 9 between the leading-out direction and the surface 16a of the wire lubricant solution is set as 50-60 degrees. Thereby the adhesion of the wire and the lubricant is increased, so that wire lubricant becomes hard to be exfoliated from the wire when a loop is formed by severe mold performing reverse deformation. The lubricant is hard to stick to a capillary, as foreign matter, and the resistance between the wire and the capillary is reduced, so that troubles causing loop abnormality are hard to be generated and the capillary exchange frequency is reduced.
申请公布号 JPH08321524(A) 申请公布日期 1996.12.03
申请号 JP19950126255 申请日期 1995.05.25
申请人 TANAKA DENSHI KOGYO KK 发明人 TOBIYAMA TAEKO;IGA SUKEHITO;NAGAMATSU ICHIRO;ITABASHI KEIKO
分类号 C23G3/02;H01L21/60 主分类号 C23G3/02
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