SEMICONDUCTOR CHIP PICKUP UNIT AND METHOD THEREFOR

摘要

PROBLEM TO BE SOLVED: To avoid unwanted peel of semiconductor chips when using a thrust stage having a spherical upper surface to avoid nicking due to mutual collision of the semiconductor chips by forming suction holes round a center thrust pin hole of the thrust stage. SOLUTION: A thrust stage 8 having a spherical top surface 12 comprises a thrust pin hole 11 at the center and suction holes 9 round it. In the hole 11 a thrust pin 6 is vertically movably provided with a collet 1 disposed above this pin 11. This fixes a part of a tape 3 around a semiconductor chip 2 to be peeled off to the spherical top surface 12 of the stage 8 through the suction holes 9 the chip. Thus it is possible to suppress a peripheral part of the tape 3 around the pin 6 from bending before and during thrusting of the pin 6 and preventing the chip 2 adhering to this part from undesired peeling.