| 摘要 |
PROBLEM TO BE SOLVED: To prevent a pad and a semiconductor chip from interfacially separating from each other and to provide a lead frame by which a semiconductor device having high reliability can be obtained. SOLUTION: This lead frame is provided with a rectangular pad 1 on which a semiconductor chip is mounted, plural leads 2 which are arranged along two sides facing each other at the shorter sides of the pad 1, two supporting bars 9 which extend in parallel toward a side rail 8 from the longer sides of the pad 1, a mold gate which is provided on a side rail and has an aperture opening toward a space between the two supporting bars and an outer lead which is extended from the inner leads. In this case a space between the two supporting bars 9 is bridged, and an auxiliary lead 6 extending in almost parallel with the longer sides of the pad at the mold gate side is provided. |
