| 摘要 |
Multi-layered, ceramic electrostatic chuck for retaining a substrate in a process chamber is provided. The chuck comprises a first layer having a top surface, a second layer disposed on the top surface of the first layer, and a third layer disposed on top of the second layer. The second layer alters the resistivity of the third layer during the fabrication process of the chuck. As such, the resistivity of the chuck is reduced to a value that facilitates establishment of the Johnsen-Rahbek effect and promotes wafer processing at room temperature. |
