| 摘要 |
<p>PROBLEM TO BE SOLVED: To enable a dummy wafer to ensure a full mechanical strength even if the diameter of the dummy wafer, which is used in a heat-treating process for a semiconductor substrate, is formed in a diameter of 30 mm or longer. SOLUTION: A dummy wafer 12 mounted on a wafer boat, which is used in a heat-treating unit for a semiconductor wafer, along with the wafer is formed of a material such as a quartz. A reinforcing part 14 is provided on the surface on one side of the surfaces of the wafer 12. Notches 16 are respectively provided in each of the ends of the part 14. The wafer 12 is mounted on the boat in such a way that the supports of the boat and the notches 16 are engaged with each other.</p> |
