| 摘要 |
PROBLEM TO BE SOLVED: To enable execution of a burn-in test for a wafer formed with a large number of dies by decreasing the number of control signals required for power-source control dies formed on a wafer for smaller device scale. SOLUTION: A power-source control circuit for controlling power on/off of dies #1-#21 formed on a wafer 1 is arranged in a matrix. Signals X1-X5 drive transistors 22-1 to 22-5 for selecting in the row direction, a power-source control circuit on matrix, and signals Y1-Y5 drive transistors 23-1-23-5 to select, in the column direction, the power-source control circuit on the matrix. Thus, no power is no longer supplied to a die corresponding to a power-source control circuit selected with the signals X1-X5 and signals Y1-Y5, while the power is continuously supplied to a die corresponding to the power-source control circuit other than that. |
