发明名称 MOLDING MADE FROM POLYPROPYLENE RESIN EXPANDABLE PARTICLE AND HEAT-INSULATION MATERIAL FOR BUILDING
摘要 PROBLEM TO BE SOLVED: To obtain a molding reduced in compression set by molding expandable particles comprising a base resin being a mixture comprising a specified amount of a PP resin, a specified amount of a PS resin, and a specified amount of other polymer components so as to produce a molding having a specified apparent density and a specified SV value. SOLUTION: Expandable particles comprising a base resin being a mixture comprising 60-95 wt.% PP resin, 5-40 wt.% PS resin, and 0-30 wt.% other polymer components are molded to obtain a molding having an apparent density of 0.009-0.045 g/cm3 and an SV value of below 4.0. SV(%)=(VO-V)×100/VO (wherein VO is the volume (mm3) of a cut sample of the molding; and V is the volume of the sample as measured after it is subjected to drying, pressure reduction, and pressure restoration to normal pressure under specified conditions). The PP resin is a propylene (co)polymer resin containing at least 70 wt.% propylene component, and the other polymer components are polymers at least one of which is a compatibilizer and are exemplified by a high-density PE and a low-density PE.
申请公布号 JP2000319439(A) 申请公布日期 2000.11.21
申请号 JP19990126762 申请日期 1999.05.07
申请人 JSP CORP 发明人 SASAKI HIDEHIRO;TAIRA AKINOBU;TOKORO TOSHIO
分类号 C08J9/228;B29C44/00;C08J9/16;C08L23/10;(IPC1-7):C08J9/228 主分类号 C08J9/228
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