| 摘要 |
PROBLEM TO BE SOLVED: To provide a grinding apparatus, equipped with a work delivery mans capable of transferring a plate-like work, such as a ground semiconductor wafer without causing damages, such as cracking to it, when being delivered from a chuck table. SOLUTION: A grinding apparatus is equipped with a chuck table which holds a work, a grinding means which grinds the work held on the chuck table, and a work delivery means which delivers the ground plate-like work from the chuck table, where the work delivery means is equipped with a fluid levitating mechanism which levitates the work, jetting fluid onto the surface of the chuck table, an insertion support member inserted between the surface of the chuck table and the plate-like work to support it, and a transfer mechanism which actuates the insertion support member. |
