发明名称 MULTILAYER PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME
摘要 PROBLEM TO BE SOLVED: To miniaturize a product line and improve product efficiency. SOLUTION: In a work, at least a pair of circuit patterns are formed. On a first column of the work, patterns are laminated in order of a first layer, a second layer, a third layer, etc., from the upper side. On a second column, patterns are laminated in order of a first layer, a second layer, a third layer, etc., from the lower side. In a photofilm for forming patterns, different patterns are printed side by side.
申请公布号 JP2001313472(A) 申请公布日期 2001.11.09
申请号 JP20000134308 申请日期 2000.04.28
申请人 SONY CORP 发明人 ISHIOKA TOSHIKI;MARUYAMA MASAHIRO;NARITA TATSUTOSHI;NISHIDA YUJI
分类号 H05K3/46;(IPC1-7):H05K3/46 主分类号 H05K3/46
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