| 摘要 |
PROBLEM TO BE SOLVED: To provide a bonding agent for semiconductor chip which can form a highly reliable soldered junction, having a high joining strength by securing an electrical insulation property, even in a high-temperature and high-humidity atmosphere without requiring the cleaning of residual flux after soldering. SOLUTION: In this semiconductor chip bonding agent, a resin (A) having at least one or more phenolic hydroxylic groups and contains <=5% free phenol and another resin (B) which acts as the curing agent of the resin (A) are mixed as essential components. |
