| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a polishing liquid preparation method and an apparatus capable of efficiently preparing polishing liquid more precisely regulated in concentration when a polishing liquid for chemically and mechanically polishing a semiconductor device is prepared. SOLUTION: A polishing liquid preparation method is a method of preparing polishing liquid, by adding additives to a slurry undiluted solution composed of water and an abrasive grain component and comprising an initial preparation process (A) of continuously preparing polishing liquid, that contains additives in a prescribed range of concentration and a concentration control process (B) of measuring the additive concentration of the polishing liquid and feeding a certain amount of the slurry undiluted solution or the additives, when the amount is short in supply. A polishing liquid preparation device is composed of a slurry undiluted solution bath (1), an additive bath (2), a mixing bath (3) for mixing the slurry undiluted solution and the additives together, a polishing liquid bath (4) for storing the polishing liquid, and a concentration measuring device (30) which takes advantage of an ultrasonic speed method.</p> |
