| 摘要 |
PROBLEM TO BE SOLVED: To form a uniform plating film which is free from any variance in film thickness of the plating film between parts to be plated by eliminating lapping of the parts to be plated in a plating solution, to facilitate the handling of the parts to be plated, and to facilitate the execution of the plating uniform in film thickness on each end part in particular. SOLUTION: This small article plating device comprises a plating tank 2 to store a plating solution 11, an anode 7 which is immersed in the plating solution 11 in the plating tank 2 and with which parts (a) to be plated are brought into contact, an anode 6 which is immersed in the plating solution 11 in the plating tank 2, and a power source 10 to flow the current in the anode 6 and the cathode 7. The current flows in the anode 6 and the cathode 7 in a condition where one end of each of a plurality of part (a) to be plated is brought into contact with a conductor on one side of the cathode 7 to deposit the plating on the parts (a). A plurality of parts (a) are collectively inverted so that the other ends of a plurality of parts (a) are brought into contact with the conductor on one side of the anode 7, and then, the current flows in the anode 6 and the cathode 7 to deposit the plating on the parts (a). |
