| 摘要 |
PROBLEM TO BE SOLVED: To effectively prevent joint breakage due to the deformation of a metal-made cover body during heating in a semiconductor device storing package. SOLUTION: In the semiconductor device storing package comprising an insulation substrate 1 having a recess part mounting a semiconductor device 3 on the upper face and a substantially flat plate-like cover body 2 jointed through a sealant 4 so as to cover the recess part on the upper face of the insulation substrate 1, the cover body 2 comprises a metal plate by a rolling processing method, length X is 3/5 or longer of the length of the cover body 2 in the rolling direction (A-B) in substantial parallel in the rolling direction (A-B) at a part opposed to the opening of the recess part and the projection part 2a of 0.5-1.5 times of the thickness of a flat plate part in height is formed.
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