| 摘要 |
PROBLEM TO BE SOLVED: To provide a method which can thin a resin package in the heightwise direction of the resin package in a structure that a semiconductor chip is bonded to the upper surface of the uplifted inner end of a straight lead frame as the straight lead frame is used for the resin package, and to provide a semiconductor device. SOLUTION: Straight lead frames 1a and 1b of the semiconductor device, which is extendedly provided in a horizontal shape and constitutes a pair of the side of an anode and the side of a cathode are used as the lead frames for a resin package, and a semiconductor chip 2 is mounted on the inner end of the lead frame 1a. After an electrode 3 on the surface of the chip 2 and the inner end of the lead frame 1b are electrically connected with each other through an Au wire 4, the lead frames 1a and 1b, the chip 2 and the wire 4 are covered and sealed with a resin 5. |
