发明名称 GAS SUPPLY METHOD OF HEAT TREATMENT EQUIPMENT AND PROCESS FOR PRODUCING CERAMIC ELECTRONIC COMPONENT
摘要 <P>PROBLEM TO BE SOLVED: To obtain a gas supply method of heat treatment equipment performing a heat treatment, e.g. sintering, of a ceramic mold and a process for producing a ceramic electronic component in which the entire article can be sintered uniformly with no variation. <P>SOLUTION: In the gas supply method of heat treatment equipment for sintering an article W wherein the space between the surface 7 for mounting the article W and a ceiling surface 8 facing the mounting surface 7 serves as a channel 9 of atmospheric gas flowing along the mounting surface 7 and the opposite ends of the channel 9 serves as the inlets 10 and 11 of atmospheric gas, the atmospheric gas is controlled to flow into the channel 9 from the inlets 10 and 11 at a velocity V satisfying a formula: 4.0&times;(L<SB>&tau;T</SB>)/(CD<SP>2</SP>)&ge;V&ge;0.5&times;(L<SB>&tau;T</SB>)/(CD<SP>2</SP>). <P>COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005050849(A) 申请公布日期 2005.02.24
申请号 JP20030202849 申请日期 2003.07.29
申请人 MURATA MFG CO LTD 发明人 HIRAKO KOICHIRO;AKIMOTO SHIGERU;HIRATA YOSUKE;ITO TAKESHI
分类号 C04B35/64;C04B35/638;F27D7/02;F27D7/06;H01G13/00 主分类号 C04B35/64
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