| 摘要 |
PROBLEM TO BE SOLVED: To improve the reliability of a product by preventing a bonding failure when a semiconductor optical sensor chip is mounted on a plastic sensor stage and is fixed by an adhesive. SOLUTION: A semiconductor device is configured so that a thermosetting/ultraviolet cure adhesive is applied in a concave groove 3b to secure a sensor chip on a fixed position on a sensor stage 3 serving as a plastic molded component having the channel-like concave groove 3b for mounting a semiconductor optical sensor chip 4 at the center of the upper surface of a bottom wall 3a. The semiconductor device comprises a flat mount 3e which is shaped like an island and mounts the sensor chip at the center of an undersurface in the concave groove formed on the bottom wall of the sensor stage, and protrusions 3d which is provided on both sides of the mount to horizontally hold the sensor chip. Further, the sides of the concave groove that are opposed to the side edges of the mount are formed into slopes 3b-1. This configuration makes it possible to prevent the adhesive, which has been applied when the sensor chip is mounted, from protruding to the outside, increase a UV irradiation area, and positively fix the sensor chip. COPYRIGHT: (C)2004,JPO |
