METHOD FOR MANUFACTURING A MICROELECTRONIC PACKAGE

摘要

The invention relates to a method of packaging an electronic microsystem (200) and further to such a packaged device. With the method a packaged electronic microsystem (200) can be manufactured using a flexible foil (80) having conductive tracks (100) on at least on side of the flexible foil. The electronic microsystem (200) and the flexible foil (80) are arranged in a way that a sealed or even hermetic package can be realized and contact pads (210) of the electronic microsystem (200) are connected to conductive tracks (100) extending to the outer surface of the packaged device after folding the flexible foil (80) in the proposed way. No vias or throughholes in the flexible foil (80) are needed.