发明名称 |
Interconnection structure of electric conductive wirings |
摘要 |
Accumulating spaces for conductive particles are formed in gaps of wiring patterns for conductive wirings which are disposed on a surface of a supporting body. When interconnecting a pair of interconnection objects having the respective wiring patterns via an anisotropic conductive film thereon due to a thermocompression bonding, the conductive particles to be flown-out into the gaps by the thermocompression bonding are allowed to escape into the accumulating spaces, so that an over-density of the conductive particles can be prevented to avoid a shortage in the wiring patterns.
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申请公布号 |
US7327042(B2) |
申请公布日期 |
2008.02.05 |
申请号 |
US20030726689 |
申请日期 |
2003.12.04 |
申请人 |
TOHOKU PIONEER CORPORATION |
发明人 |
OHAZAMA HIDETAKA |
分类号 |
H01L23/48;H05B33/06;G09F9/00;G09F9/30;H01L23/52;H01L27/32;H01L29/40;H01L51/50;H01R11/01;H05K1/14;H05K3/32;H05K3/36 |
主分类号 |
H01L23/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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