| 摘要 |
<P>PROBLEM TO BE SOLVED: To prevent dissipation of conductive particles inserted and held between a bump electrode at the side of a semiconductor device such as an LCD driver, and an opposing side electrode such as an electrode at the side of a mounting substrate connected with being opposing to the bump electrode, during mounting, so that an electrical continuity property between the both electrodes can be sufficiently ensured. <P>SOLUTION: A frame like convex portion is formed along the periphery of the electrode surface of a bump electrode 14 and serves as a stopper 14a. A wiring electrode 11 having a layer thickness that can be changed is provided below the position where the stopper 14a is formed, so that the height of the stopper 14a can be adjusted in accordance with the particle diameter of conductive particles in an anisotropic conductive film used during mounting. The height adjustment of the stopper 14a may be performed, for example, by a lamination structure of the wiring electrode 11 and a passivation film 12. <P>COPYRIGHT: (C)2008,JPO&INPIT |
