| 摘要 |
A heat dissipation device with a heat pipe includes a base for thermally engaging with an electronic device, a first fin assembly and a second fin assembly arranged on the base, and a heat pipe thermally connecting the first and second fin assemblies with the base. The first fin assembly has a first contacting face defining two grooves and the second assembly has a second contacting face facing to the first contacting face defining two grooves. The heat pipe includes an evaporation section thermally connecting with the base and the first and second fin assemblies, a first condensation section and a second condensation section respectively thermally engaging in the grooves of the first contacting face of the first fin assembly and the second contacting face of the second fin assembly. |
