PLASMA PROCESSING APPARATUS, PLASMA PROCESSING METHOD AND END POINT DETECTING METHOD

摘要

A plasma processing apparatus (100) is provided with a plasma generating means for generating plasma in a chamber (1); a measuring section (60) for measuring the integration value of the particle number of active species moving toward a subject to be processed (wafer (W)) in plasma; and a control section (50) which controls plasma processing to be ended when the integration value of the measured particle number reaches a set value. The measuring section (60) measures the particle number of the species by radiating a prescribed laser beam toward plasma from a light source section (61) and receiving light by a detecting section (63) having a VUV monochromator.