ELECTROLESS PURE PALLADIUM PLATING SOLUTION

摘要

An electroless pure palladium plating solution capable of forming a pure palladium plating film with less unevenness of plating film is provided. The solution is characterized by comprising an aqueous solution containing (a) 0.001 to 0.5 mol/L of a water-soluble palladium compound, (b) 0.005 to 10 mol/L of at least two members selected from aliphatic carboxylic acids and water-soluble salts thereof, (c) 0.005 to 10 mol/L of phosphoric acid and/or phosphate, and (d) 0.005 to 10 mol/L of sulfuric acid and/or sulfate.