| 摘要 |
PROBLEM TO BE SOLVED: To improve moisture resistance reliability in an electronic component in a mounting structure of the electronic component.SOLUTION: A taping electronic component train is constructed so that, on a first side surface 10c, a thickness of the side of a first principal surface 10a of a first terminal electrode 15 is smaller than that of the side of second principal surface 10b of the first terminal electrode 15, on a second side surface 10d, the thickness of the side of first principal 10a of a second terminal electrode 16 is smaller than that of the side of second principal surface 10b of the second terminal electrode 16, and the first principal surface 10a of each of a plurality of electronic component is arranged so as to face to a bottom surface of a concave part 31.SELECTED DRAWING: Figure 10 |
