发明名称 |
Adjustable heat sink supporting multiple platforms and system configurations |
摘要 |
An adjustable heat sink which allows factory, service, or customers to adjust the width of the heat sink to take advantage of some or all available unpopulated DIMM space to optimize cooling and performance. Such an adjustable heat sink addresses many of the limitations of other heat sinks and is advantageous for reducing part numbers within a platform and across platforms. Such an adjustable heat sink also simplifies field upgrades when either adding or removing populated DIMMs to an information handling system thus enhancing performance without a need to change CPU Heat sinks. |
申请公布号 |
US9377828(B2) |
申请公布日期 |
2016.06.28 |
申请号 |
US201313964466 |
申请日期 |
2013.08.12 |
申请人 |
Dell Products L.P. |
发明人 |
Tunks Eric M.;Berke Stuart Allen |
分类号 |
G06F1/20;F28D15/02;H05K7/20 |
主分类号 |
G06F1/20 |
代理机构 |
Terrile, Cannatti, Chambers & Holland, LLP |
代理人 |
Terrile, Cannatti, Chambers & Holland, LLP ;Terrile Stephen A. |
主权项 |
1. A heat sink comprising:
a main portion, the main portion comprising a heat sink base and a heat dissipation portion; an extendable portion thermally coupled to the main portion, the extendable portion comprising an adjustable heat sink base and a heat dissipation portion; and, another extendable portion thermally coupled to the main portion, the another extendable portion comprising an adjustable heat sink base and a heat dissipation portion; an adjustment mechanism, the adjustment mechanism thermally and physically coupling the main portion, the extendable portion and the another extendable portion; and wherein the extendable portion and the another extendable portion are positioned on opposite sides of the main portion, the extendable portion extending perpendicularly from the base portion in a first direction and the another extendable portion extending perpendicularly from the base portion in a second direction, the second direction being opposite that of the first direction; and, the extendable portion is configured to selectively extend over a portion of first and second memory sockets of an information handling system motherboard depending on whether memory modules are inserted within one or both of the first and second memory sockets and the another extendable portion is configured to extend over third and fourth memory sockets of an information handling system motherboard a portion of a memory socket of the information handling system motherboard depending on whether memory modules are inserted within one or both of the third and fourth memory sockets. |
地址 |
Round Rock TX US |