PACKAGED SEMICONDUCTOR DEVICE HAVING LEADFRAME FEATURES PREVENTING DELAMINATION

摘要

In described examples, a semiconductor device has a leadframe with a first pad surface (401a) and a parallel second pad surface, and an assembly pad (410) bordered by two opposing sides, which include through-holes (420) from the first pad surface (401a) to the second pad surface. Another pad side includes one or more elongated windows (421) between the pad surfaces. The second pad surface includes grooves. The leadframe further has leads (430) with opposite elongated sides castellated by indents (431). Layers (440) of bondable metals are restricted to localized areas surrounding bond spots. A semiconductor chip (450) is attached to the pad (410) and wire-bonded (460) to the bond spots. A package (470) encapsulates the chip (450), wires, pad (410) and lead (430) portions, and secures the leadframe into the package (470) by filling the through-holes (420), windows (421), grooves and indents (431).