METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a method for manufacturing a semiconductor package highly demanding miniaturization and higher density and supporting three dimensions with highly sufficient efficiency and at a low cost.SOLUTION: A method for manufacturing a semiconductor device comprises the steps of: (I) fixing a semiconductor element onto an extremely thin metal foil of a peelable metal foil via a photosensitive underfill film; (II) sealing the semiconductor element using a sealing material; (III) exposing a rear surface of the extremely thin metal foil; (IV) forming a wiring pattern by processing the extremely thin metal foil; and (V) forming a rewiring insulation layer on the wiring pattern.SELECTED DRAWING: Figure 6