PRINT WIRING BOARD AND MANUFACTURING METHOD THEREOF

摘要

PROBLEM TO BE SOLVED: To provide a print wiring board hardly generating warp even when a polyimide layer and a thermoplastic polyimide layer are included.SOLUTION: The print wiring board includes: a wiring base board which has an insulator layer and a conductor wiring disposed on the insulator layer; and an adhesion layer 4 formed over the wiring base board covering the conductor wiring. The insulator layer includes a polyimide core layer and two thermoplastic polyimide cover layers formed over both surfaces of the core layer. The adhesion layer 4 is formed of thermoplastic polyimide, and the conductor wiring is embedded in the adhesion layer 4.SELECTED DRAWING: Figure 1