| 发明名称 | Chemical sensor package for highly pressured environment | ||
| 摘要 | A package for a chemical sensor including an encapsulation and a pressure balancing structure is disclosed. The encapsulation encapsulates a chemical sensor and has a hole for exposing a chemical sensitive part of the chemical sensor. The pressure balancing structure balances pressure applied to the chemical sensor at the chemical sensitive part. | ||
| 申请公布号 | US9431315(B2) | 申请公布日期 | 2016.08.30 |
| 申请号 | US201414583261 | 申请日期 | 2014.12.26 |
| 申请人 | Agency for Science, Technology and Research | 发明人 | Woo Daniel Rhee Min;Hwang How Yuan;Chidambaram Vivek;Chan Yuen Sing;Wai Eva Leong Ching;Lee Jong Bum |
| 分类号 | H01L21/56;H01L23/31;H01L29/78;H01L29/66;G01N27/414 | 主分类号 | H01L21/56 |
| 代理机构 | Schwegman Lundberg & Woessner, P.A. | 代理人 | Schwegman Lundberg & Woessner, P.A. |
| 主权项 | 1. A chemical sensor package for highly pressured environment comprising: an encapsulation for encapsulating a chemical sensor, having a hole for exposing a chemical sensitive part of the chemical sensor for sensing purpose; a pressure balancing structure for balancing pressure applied to the chemical sensor at the chemical sensitive part, wherein the pressure balancing structure is a pressure balancing hole for applying counter pressure to the chemical sensor at the opposite side of the chemical sensitive part; and a Redistribution Layer (RDL) on the chemical sensor for moving a wiring outside of the encapsulation away from the opposite side of the chemical sensitive part. | ||
| 地址 | Singapore SG | ||