| 摘要 |
PROBLEM TO BE SOLVED: To obtain an electronic component which is superior in airtightness of its internal space, and accordingly is satisfactory in moisture resistant characteristic in a structure, wherein first and second case materials are bonded together and the sealed internal space is constituted. SOLUTION: An electronic component is formed into a structure, wherein first and second case materials 1 and 2, at least one side of which is constituted of a resin which can be plated are bonded together and an internal space sealed by a recessed part 1a is constituted, and a circuit having electrodes 3a to 3c and the like is constituted in the internal space. At this time, by the bonding to the case materials 1 and 2, a plated layer 7 formed on the bonded surface of the case material 1 and a plated layer 8 formed on the bonded surface of the case material 2 are bonded together via a solder layer 9 and the circuit in the internal space is connected with external electrodes 5a to 5f via through- hole electrodes 6a to 6f in via holes filled with solder. |
