发明名称 |
ELECTRONIC CIRCUIT DEVICE |
摘要 |
PROBLEM TO BE SOLVED: To improve vibration resistance of a connection terminal 23 with a tip solder bonded to a circuit board 13.SOLUTION: A controller comprises: a metal controller housing 6 which stores a circuit board 13; and a connection terminal 23 which extends from an actuator housing 3 through an opening 24 and has a tip fixed to the circuit board 13. The controller further comprises a semiconductor switching element 27 and an electrolytic capacitor 28 which are heat generating components and collectively arranged in a region adjacent to the connection terminal 23; and a heat mass 30 where the circuit board 13 is adhesively fixed to a top face 30a via a thermal adhesive 31. The thermal adhesive 31 improves heat dissipation and since the circuit board 13 is fixed to a controller housing 6 near the connection terminal 23, a load due to vibration is reduced.SELECTED DRAWING: Figure 6 |
申请公布号 |
JP2016164900(A) |
申请公布日期 |
2016.09.08 |
申请号 |
JP20150044131 |
申请日期 |
2015.03.06 |
申请人 |
HITACHI AUTOMOTIVE SYSTEMS LTD |
发明人 |
WATABE HIROFUMI;TAKAHASHI YASUMICHI;NAKANO KAZUHIKO |
分类号 |
H05K7/14;B60T13/74;H01L23/40;H05K1/02;H05K5/04;H05K7/20 |
主分类号 |
H05K7/14 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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