| 摘要 |
PROBLEM TO BE SOLVED: To provide a power semiconductor module that has a form which has wiring patterns laminated to achieve low inductance, achieves high heat radiation performance, and inhibits damage caused by a difference of heat expansion coefficients.SOLUTION: A power semiconductor module 100 includes: a first isolation layer 2; a first wiring pattern 33; a second isolation layer 4; a second wiring pattern 5; and a semiconductor element 7. The first wiring pattern 3 is formed in at least a part on the first isolation layer 2. The second isolation layer 4 is laminated on at least a part on the first wiring pattern 3. The second wiring pattern 5 is formed in at least a part on the second isolation layer 4 so as to include a portion overlapping with the first wiring pattern 3. The semiconductor element 7 is disposed on an area other than an area in which the second isolation layer 4 is formed in a plan view. The first isolation layer 2 and the second isolation layer 4 are formed by a ceramic material.SELECTED DRAWING: Figure 1 |
