| 摘要 |
1,066,144. Machining by laser beams. INTERNATIONAL BUSINESS MACHINES CORPORATION. Feb. 24, 1966 [March 1, 1965], No. 8090/66. Heading B3V. [Also in Division H1] A hole is bored in a substrate 3 plated on one surface 4 by a beam of energy 1 acting on the opposite surface, which beam also vaporizes the plating causing to condense on the wall of the hole The beam is generated by as ruby laser 7, focused by a lens 2a and excited by a a flash tube 8 supplied through a charging control 16. The workpiece may be enclosed in a vacuum or inert gas-filled chamber. Substrate 3 may be of ceramic, glass, epoxy resin or a semi-conductor material and the plating 4 may be of noble metal such as gold. |
