发明名称 HIGH-FREQUENCY CIRCUIT MODULE AND MOUNTING STRUCTURE FOR HIGH-FREQUENCY CIRCUIT MODULE
摘要 PROBLEM TO BE SOLVED: To obtain a high-frequency circuit module which prevents a drop in the Q-value of a microstrip line, formed inside a plurality of dielectric layers which constitute a multilayered substrate. SOLUTION: At least a first dielectric layer 2a, a second dielectric layer 2b, and a third dielectric layer 2c are laminated sequentially. A first grounding conductor layer 13 is formed between the first dielectric layer 2a and the second dielectric layer 2b. A belt-like microstrip line 4 is formed between the second dielectric layer 2b and the third dielectric layer 2c to face opposite the first grounding conductor 3. A first dielectric removed hole 5 which is formed by cutting off the third dielectric layer 2c is formed in the third dielectric layer 2c, so as to face the microstrip line 4. A metal plate 8 which closes the first dielectric removed hole 5 on a face on the side opposite to a face on the side of the second dielectric layer 2c is installed on the third dielectric layer 2c. The metal plate 8 is connected to the first grounding conductor layer 3.
申请公布号 JPH11168153(A) 申请公布日期 1999.06.22
申请号 JP19970334279 申请日期 1997.12.04
申请人 ALPS ELECTRIC CO LTD 发明人 NAKANO KAZUHIRO
分类号 H01L23/12;H01L25/04;H01L25/18;H01P3/08;H05K1/00;H05K1/02 主分类号 H01L23/12
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