| 摘要 |
<p>MULTI-COMPONENT MICROCIRCUIT PACKAGES A multi-component microcircuit package is formed from a plurality of separate components which are secured together to form a lower package portion having a base and a continuous composite side wall frame having irregularities on its upper surface as a result of the component junctions. Secured to the top of this side wall frame is a one-piece continuous top frame member having a uniform upper surface. This top frame member covers the irregularities present in side wall frame and provides a surface more suitable for hermetic sealing of a package lid to the package.</p> |
