发明名称 GLASS SEALING METHOD FOR AIRTIGHT PACKAGE OF CIRCUIT ELEMENT
摘要 <p>PURPOSE:To improve yield by sealing the circumference of the lead wire insertion part of a glass body, where a lead wire is run, while pressing it. CONSTITUTION:On a cradle 7 which has a hole 6 where a lead wire 3 runs, a base 1 holding glass 2 where the lead wire 3 runs is placed with the inner side up, and a carbon weight 12 is mounted near the lead wire insertion part 11 to press the glass 2 by the weight of the carbon weight 12. The load by this pressing is favorably 2-10g. While the circumference of the lead wire insertion part 11 of the glass 2 is pressed, the glass 2 is fused by being heated at 900- 1,000 deg.C for sealing. Thus, the glass is prevented from rising along the lead wire, and consequently the yield is improved remarkably.</p>
申请公布号 JPS5836011(A) 申请公布日期 1983.03.02
申请号 JP19810133786 申请日期 1981.08.26
申请人 FUJI DENKA:KK 发明人 KUSANO TOSHIYUKI;NISHIMURA TADASHI
分类号 H01L41/22;H01L41/02;H03H3/007 主分类号 H01L41/22
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