| 摘要 |
PURPOSE:To isolate a plurality of semiconductor pellets from each other previously to a pellet assembly process by a method wherein a sheet is put on an expansion ring part formed on an X-Y table and expanded. CONSTITUTION:An expansion ring 13 is attached on an X-Y table 11 of a die- bonding apparatus. A sheet 16 on which a plurality of divided pellets 14 is spread on a dicing plate 15 and put on the expansion ring 13 so as to make the center of the dicing plate 15 coinside with the center of the expansion ring 13. A chuck 19 is descended while a clamp 22 is held by the chuck 19. The dicing plate 15 is moved downward while being pushed on its upper surface by the clamp 22. The sheet 16 is expanded by a top end surface of the expansion ring 13 so that the pellets 14 are isolated from each other.
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