发明名称 Lead frames with dielectric housings molded thereon
摘要 Electrical lead frames are stamped from a strip of metal, each of the lead frames including spaced metal strips extending between carrier members. Projections extend outwardly from the metal strips. A dielectric housing is molded onto each of the lead frames and includes recesses in one surface exposing respective projections and holes extending through the housing in communication with the respective projections so that the electrical leads of electronic components and electrical wires can be inserted into the holes in electrical engagement with the projections and secured therein by the projections.
申请公布号 US4600971(A) 申请公布日期 1986.07.15
申请号 US19840609165 申请日期 1984.05.11
申请人 AMP INCORPORATED 发明人 ROSE, WILLIAM H.;SHAFFER, DAVID T.
分类号 H05K3/20;H05K3/30;H05K3/32;H05K3/40;H05K7/12;(IPC1-7):H05K5/02 主分类号 H05K3/20
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