Optical component mounting

摘要

An improved technique for mounting optical components on a substrate comprises providing each component with a dedicated heating element on the component itself to permit controlled and well-localized heating of solder on the substrate during fixing. In the example illustrated the optical component is an optical fibre carrier comprising fibre (10), carrier plate (12) and heating element (20), which itself comprises an ink film resistor (22) deposited on a ceramic chip (21) having metallized electrical contacts (23).