| 摘要 |
PURPOSE:To enable an optical semiconductor element chip to be positioned and fixed correctly in an optical device by adapting the optical semiconductor element chip to be positioned to positioning means and die bonded onto bonding pads. CONSTITUTION:An optical semiconductor device of the invention comprises an optical semiconductor element chip 1, a flexible printed circuit board (FPC) 2 to which the optical semiconductor element chip 1 is die bonded and a fixing member 3 to which the FPC 2 is fixed. The fixing member 3 is provided with first and second positioning holes 3a and 3b. Further, an opening 4 is formed in the inner part of the fixing member 3. The optical semiconductor element chip 1 is positioned to the positioning holes 3a and 3b and die bonded on die bonding pads on the FPC 2. According to this method, the optical semiconductor element chip 1 can be positioned correctly at a predetermined position only by fixing the positioning holes 3a and 3b correctly at predetermined positions on the optical device.
|
