METHOD FOR REMOVING ORGANIC FILM

摘要

A method of removing organic coating which is vary effective in removing photoresist films in a process of manufacturing semiconductor devices. The organic film is removed by treating a substrate (32) on which a photoresist film (31) is formed in a wet-type processing vessel (34) which is filled with a processing liquid suc h as a mixture of sulfuric acid and hydrogen peroxide water, or in an ozone processing vessel (34) fillers with a liquid obtained by adding ozone or ozone water to ultra-pure water after the dry processing of the substrate with ozone or oxygen plasma.