| 摘要 |
PURPOSE:To obtain a multilayer metal base substrate adapted for mounting an electronic device component such as a power module hybrid IC with a control function, which has excellent adhesive strength of a multilayer substrate to a metal base substrate and particularly excellent heat resistance, and easy manufacture. CONSTITUTION:A multilayer metal base substrate wherein a multilayer substrate 1 having a porous conductor layer 13 on its rear surface is adhered to a metal base substrate 3 via adhesive 2 through the rear surface. |
