| 摘要 |
PROBLEM TO BE SOLVED: To surely detect that a bump has not bonded to the electrode of an IC due to marks or contaminants on the surface of the electrode of the IC in a non-contact manner, without taking the effects of current conduction to the IC into consideration. SOLUTION: A protruding electrode is formed through a method, wherein an electrical discharge takes place between a wire 2 and a torch 5 to form a ball 2d at the tip of the wire 2, and the ball 2d is bonded to the electrode of the IC 4. In this case, a potential difference between the wire 2 and the torch 5 is detected when a following ball is formed, and when it is found that a discharge start voltage exceeds a threshold voltage which is inputted via an I/O connector 15, it is determined that a ball has not bonded, when non- bonding detection signals are outputted from a non-bonding detection circuit 13. |
