| 摘要 |
PROBLEM TO BE SOLVED: To suppress the decline in jointing strength between a surface conductor layer and a metal plating layer to be as small as possible, without decreasing the matching in shrinkage at the time of simultaneous baking, in a simultaneously baked ceramic wiring board for which there is no established technology of selectively eliminating ceramic particles from the surface conductor layer. SOLUTION: At least at the surface of a ceramic substrate 2, a conductor layer 8 is formed which is formed by baking simultaneously with the ceramic substrate 2 and which contains a high-melting point metal and ceramic particles. On a conductor layer 8, a metal plating layer 9 is formed. The conductor layer 8 is constituted of a first conductor layer 10, formed on the ceramic substrate 2 side and a second conductor layer 11 which is formed on the metal plating layer 9 side and which contains proportionately more high-melting point metal than the first conductor layer 10 does. |
