| 摘要 |
<p>Processing is started (S1), and control of each mounting processing is sequentially executed under a mounting program command in a storage section (S2). An electronic component is positioned on a mounting head, then taken out and held (S3). A BGA component is positioned by position detection of a reference mark and inspection, and correction is carried out in response to discrimination of holding attitude. In inspection using the reference mark as a reference position, the quality of the component is discriminated, for example, loss and shift of a solder bump and insufficiency of the quantity of the solder (S4). A normal component is moved to the vicinity of a mounting position on a printed board on a mounting table by the mounting head (S5). A recognition mark at the target mounting position on the printed board is confirmed and recognized (S6). The mounting position is corrected by mounting positioning based on the results of mounting position detection and component inspection (S7). The height of the mounting head is controlled and the component is mounted (S8). In response to the presence or absence of a mounting component, the processing shifts to processing S1 for continuation of processing, or shifts to processing S10 for end (S9) and the processing ends (S10).</p> |
