| 摘要 |
PROBLEM TO BE SOLVED: To obtain an exchanging jig capable of suppressing the thermal effect on the periphery of a semiconductor package extremely to a low level, not having the necessity of secoring a space for exclusive use around this semiconductor package either as well, capable of performing the removing work of the semiconductor package easily, and making high-density packaging possible. SOLUTION: An exchanging jig 31 on the occasion of removing surface mounted semiconductor package 11 from a circuit board 10 has a flay jig body 32. The jig body 32 is supported by the package body 20 of the semiconductor package, is put between the package body and the circuit board, and generates heat and raises its temperature, or is heated to a temperature high enough to melt solder for joining a solder bump with a pad. And this jig body 32 has a plurality of openings 34 for letting the above-mentioned solder bumps to be inserted. |
