| 摘要 |
PROBLEM TO BE SOLVED: To achieve integration of circuit boards imparted both with highly reliable electrical connection and insulation isolation by thrusting connecting portions on one surface of one circuit board, permitting the connecting portions to, respectively, face with the connecting portions of another circuit board, and connecting the two circuit boards in a conductive or non-conductive manner with the interposition of an anisotropically conductive bonding agent layer between the bonding surfaces of the circuit boards. SOLUTION: A circuit board 1 is located so that electrically connecting portions 1a which are selectively thrusted therefrom face, respectively, with electrically connecting portions 2a of another circuit board 2. Each of the circuit boards 1, 2 consists of an insulator made of a material based on a glass epoxy-resin and copper foils which are respectively provided on both surface of the insulator. Each of the connecting portions 1a of the circuit board 1 is made of a portion of the copper foil, which has been deformed and thrusted by a selective pressure of a conductive bump 1c which passes through an insulating layer 1b. An anisotropically conductive bonding agent layer 3 is interposed between the bonding surfaces of the circuit boards 1, 2, so that the connecting portions 1a, 2a are precedently compressed thereto to form conductive regions 3a, simulataneously bonding non-conductive regions 3b to the circuit boards 1, 2 insultingly as well as mechanically. |
