Apparatus for manufacturing adhesive layer, apparatus for manufacturing double-sided substrate, and apparatus for manufacturing multi-layered substrate

摘要

PCT No. PCT/JP98/01903 Sec. 371 Date Dec. 18, 1998 Sec. 102(e) Date Dec. 18, 1998 PCT Filed Apr. 24, 1998 PCT Pub. No. WO98/49877 PCT Pub. Date Nov. 5, 1998It is an object to provide an apparatus for manufacturing adhesive layers which can be manufactured in a manufacturing process which is fine, which exhibits an excellent mounting efficiency, which does not require a plating process and which is clean, double-sided substrates and multilayer substrates. A bonding-layer forming portion (5) incorporates a bonding portion (1), a hole machining portion (2), a charging portion (3) and a separating portion (4). A double-sided-substrate forming portion incorporates a bonding portion (6), a hole machining portion (7), a charging portion (8) and a separating portion (9), further incorporating a laminating portion (10), a resin hardening portion (11) and a pattern forming portion (12). The apparatus for manufacturing the multilayer substrate has a multilayer laminating portion (13), a resin hardening portion, a resin hardening portion (14) and an outer-layer-patter forming portion (15) to follow the bonding-layer forming portion (5) and the double-sided-substrate forming portion (16).