发明名称 Method of forming semiconductor features and a semiconductor structure
摘要 <p>A semiconductor structure, having a semiconductor dielectric material having an opening. A first material lining the opening, the first material comprising MXY, where M is selected from the group consisting of cobalt and nickel, X is selected from the group consisting of tungsten and silicon and Y is selected from the group consisting of phosphorus and boron and a second material filling the lined dielectric material.</p>
申请公布号 GB0106693(D0) 申请公布日期 2001.05.09
申请号 GB20010006693 申请日期 2001.03.16
申请人 INTERNATIONAL BUSINESS MACHINES CORPORATION 发明人
分类号 H01L21/288;H01L21/28;H01L21/3205;H01L23/52;H01L23/522 主分类号 H01L21/288
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